Microelectronics Assembly
Alphatek, Inc only represents the
best microelectronics assembly product
manufacturers listed below:
Products
Alphatek, Inc is proud to work with the following
microelectronics assembly product manufacturers:
The new NXT-H hybrid assembly system. High accuracy placement of die from wafers, waffle packs or trays. Also, reel feeder parts.
High-performance solder pastes and a wide range of other solders and fluxes.
Automated die attach equipment for adhesive, eutectic, silver glass, MCM and flip chip processes.
Wafer probers and application board probers. Over 16 different models and 60 years of experience. Technological advancements not available from other manufacturers.
Hi-rel equipment to remove lids from hermetic packages. Hi-rel die removal equipment.
High throughput optically based equipment for gross and fine leak testing of hermetic packages without helium bombing. Meets Mil Std 883K.
Vacuum soldering systems to provide void-free solder connections in power modules with preforms and/or pastes for semiconductor, power, electro-optical, RF industries and more.
Semiautomatic ball placement for wafers, substrates and BGAs. Minimum ball 100 µm diameter.
Satisfaction Guaranteed
Our depth of knowledge about the current electronic manufacturing climate is extensive. We are able to assist our customers with knowledge of all the many processes of the electronic manufacturing environment.